An intelligent vision system for inspection of packaged ICs

Author

Mital, Dineah P. ; Khwang, Tech Eem

Author_Institution

Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore

fYear

1989

fDate

22-24 Nov 1989

Firstpage

1003

Lastpage

1006

Abstract

A visual inspection system for recognizing defects in IC packages is presented. In this system, the iconic domain of two-dimensional gray level image analysis based on the feature extraction method is used. A software package is developed to carry out the extraction of defects that may exist on the IC leads and the surface of the IC chip. The recognition of these defects is achieved by comparing the image data with a predefined threshold value. To improve the speed of performance of the system, an auto-windowing routine is incorporated in the system to map out the relevant areas for image processing. The inspection algorithms and various processes used by the system are outlined. From the experimental results obtained, it is shown that high accuracy and good reliability can be achieved by the proposed system

Keywords

artificial intelligence; automatic optical inspection; computer vision; computerised pattern recognition; factory automation; integrated circuit manufacture; packaging; 2D gray level image analysis; IC manufacture; IC packages; auto-windowing routine; computer vision; feature extraction; image processing; software package; visual inspection system; Data mining; Feature extraction; Image analysis; Image processing; Image recognition; Inspection; Integrated circuit packaging; Intelligent systems; Machine vision; Software packages;

fLanguage

English

Publisher

ieee

Conference_Titel

TENCON '89. Fourth IEEE Region 10 International Conference

Conference_Location

Bombay

Type

conf

DOI

10.1109/TENCON.1989.177100

Filename

177100