Title :
A material system for high precision embedded polymer resistor
Author_Institution :
Embed Technol. Co., LTD, Taoyuan, Taiwan
Abstract :
As we know, the dimension of embedded polymer resistor is directly related to the resistance. Therefore the stability of dimension of polymer resistor during curing process. for polymer resistor is directly related to the tolerance of resistance. The dimension control during thermal curing process for polymer resistor paste was been discussed and achieved by making an additional empty cavity before printing the polymer resistor paste. This paper is introduced a new material system for high precision embedded polymer resistor. The one of advantages of this material system is to control the dimension of polymer resistor paste during thermal curing process without making an empty cavity before printing polymer resistor paste. The material was stand alone and maintains the dimension during the thermal curing process. Because of the maintained dimension of polymer resistor, the tolerance of resistance of cured resistor was controlled under +/- 10% without additional process (such as laser trimming). Also because of even thickness of polymer resistor, it makes easier to apply laser trimming process to bring the tolerance down to +/- 1%.
Keywords :
curing; electronics packaging; polymer films; printed circuit manufacture; thick film resistors; curing process; dimension stability; embedded polymer resistor; high precision; paste printing; tolerance; tunneling barrier model; Conducting materials; Curing; Electric resistance; Polymer films; Printing; Resistors; Solids; Solvents; Surface resistance; Thermal resistance;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on
Print_ISBN :
0-7803-8436-9
DOI :
10.1109/ISAPM.2004.1287992