Title :
Molecular dynamics study on coalescence of silver (Ag) nanoparticles and their deposition on gold (Au) substrates
Author :
Dong, Hai ; Moon, Kyoung-Sik ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Molecular dynamics (MD) simulation was conducted to investigate the coalescence of Ag nanoparticles and their deposition on a gold substrate at various temperatures from 400 K to 1000 K, using embedded atom method (EAM). Density distribution function, x-z plane projection, spreading index, and coalescence index were analyzed to gain more insights into the sintering and diffusion process. Simulation results showed that Ag and Au atoms can diffuse into each other significantly at a temperature of 1000 K and reform intermetallic lattice structure after the temperature is cooled back to 400 K. Simulation data also demonstrated that even at a low temperature of 400 K, metal spheres can be collapsed and deposited on the substrate. Yet higher temperatures were helpful in enhancing the degree of collapsing and deposition.
Keywords :
chemical interdiffusion; gold; molecular dynamics method; nanoparticles; silver; surface diffusion; wetting; 400 to 1000 K; Ag-Au; Au; coalescence index; collapsing; density distribution function; diffusion process; embedded atom method; fine pitch line patterns; gold substrates; intermetallic lattice structure; metal fillers; molecular dynamics simulation; nanoparticles deposition; plane projection; polymer binder; silver nanoparticles coalescence; sintering process; spreading index; Atomic layer deposition; Conductivity; Environmentally friendly manufacturing techniques; Gold; Inorganic materials; Lead; Nanoparticles; Polymers; Silver; Temperature;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on
Print_ISBN :
0-7803-8436-9
DOI :
10.1109/ISAPM.2004.1288006