Title :
A method to evaluate effects of moisture absorption on dielectric constant and dissipation factor of printed circuit board materials
Author :
Heinola, J.-M. ; Lätti, K-P ; Silventoinen, P. ; Ström, J-P ; Kettunen, M.
Author_Institution :
Lappeenranta Univ. of Technol., Finland
Abstract :
In this article a new method to evaluate, effects of moisture absorption on dielectric constant and dissipation factor in function of temperature and frequency are presented. The development of method is based on the experimental measurements and the use of ring resonator structures implemented to FR4-type material. The experimental measurement procedure was carried out at frequency range from 1 GHz to 10 GHz. The used temperature points were 23°C and 85°C. The results gained by the presented method were observed to be reproducible and consistent with the amount of the absorbed moisture. The method can be applied to different printed circuit board materials.
Keywords :
UHF measurement; dielectric loss measurement; dielectric losses; microstrip resonators; microwave measurement; moisture; permittivity; permittivity measurement; printed circuits; sorption; 1 to 10 GHz; FR4-type material; dielectric constant; dissipation factor; frequency characteristics; humidity absorption; immersion test; microstrip structures; moisture absorption; printed circuit board materials; ring resonator structures; Absorption; Dielectric constant; Dielectric materials; Frequency; Laminates; Moisture; Printed circuits; Resins; Temperature dependence; Testing;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on
Print_ISBN :
0-7803-8436-9
DOI :
10.1109/ISAPM.2004.1288020
