A method to evaluate effects of moisture absorption on dielectric constant and dissipation factor of printed circuit board materials

Author

Heinola, J.-M. ; Lätti, K-P ; Silventoinen, P. ; Ström, J-P ; Kettunen, M.

Author_Institution

Lappeenranta Univ. of Technol., Finland

fYear

2004

fDate

2004

Firstpage

241

Lastpage

246

Abstract

In this article a new method to evaluate, effects of moisture absorption on dielectric constant and dissipation factor in function of temperature and frequency are presented. The development of method is based on the experimental measurements and the use of ring resonator structures implemented to FR4-type material. The experimental measurement procedure was carried out at frequency range from 1 GHz to 10 GHz. The used temperature points were 23°C and 85°C. The results gained by the presented method were observed to be reproducible and consistent with the amount of the absorbed moisture. The method can be applied to different printed circuit board materials.

Keywords

UHF measurement; dielectric loss measurement; dielectric losses; microstrip resonators; microwave measurement; moisture; permittivity; permittivity measurement; printed circuits; sorption; 1 to 10 GHz; FR4-type material; dielectric constant; dissipation factor; frequency characteristics; humidity absorption; immersion test; microstrip structures; moisture absorption; printed circuit board materials; ring resonator structures; Absorption; Dielectric constant; Dielectric materials; Frequency; Laminates; Moisture; Printed circuits; Resins; Temperature dependence; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on

Print_ISBN

0-7803-8436-9

Type

conf

DOI

10.1109/ISAPM.2004.1288020

Filename

1288020