DocumentCode :
2840594
Title :
Plastic packaging of optical modules for the access network system applications
Author :
Tatsuno, Kyoichi
Author_Institution :
Hitachi Ltd., Tokyo, Japan
fYear :
1998
fDate :
22-27 Feb. 1998
Firstpage :
346
Lastpage :
347
Abstract :
Summary form only given. Cost reduction and mass production of optical modules are essential requirements for the realization of optical subscriber access network systems keeping high-speed bi-directional digital fiber communication performance, which are expected by the coming multimedia generation. In this paper, plastic optical modules applying technologies, which have been developed in the field of LSIs are proposed. They are passive surface mountings on Si sub-mounts for bare components and plastic packagings. These technologies lead low-cost solution and mass production for the optical communication modules with high performance and high reliability.
Keywords :
integrated optoelectronics; modules; optical fibre subscriber loops; optical receivers; optical transmitters; plastic packaging; MiniDIL receivers; MiniDIL transmitter; cost reduction; high performance; high reliability; mass production; optical modules; optical subscriber access network systems; passive surface mountings; plastic packaging; silicon sub-mounts; Erbium; Fiber nonlinear optics; High speed optical techniques; Length measurement; Nonlinear optics; Optical fiber networks; Optical fibers; Optical sensors; Plastic packaging; Wavelength measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optical Fiber Communication Conference and Exhibit, 1998. OFC '98., Technical Digest
Conference_Location :
San Jose, CA, USA
Print_ISBN :
1-55752-521-8
Type :
conf
DOI :
10.1109/OFC.1998.657460
Filename :
657460
Link To Document :
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