Comparison among individual thermal cycling, vibration test and the combined test for the life estimation of electronic components

This study focuses on examining the resulting stresses of the corner solder ball which is most vulnerable to damage on the flip chip ball grid array (FCBGA) components. A series of tests including thermal cycling, vibration, and highly accelerated life test (HALT) were conducted. Meanwhile, the finite element analysis (FEA) with the commercial ANSYS software was also performed for all the foregoing test conditions. The differences on the resulted strains among the individual thermal cycling, vibration, and HALT test were compared.