Title :
Total system power minimization of microprocessors using refrigerated systems for electronic cooling
Author :
Park, Won Ho ; McCall, Ron ; Yang, C. K Ken
Author_Institution :
Univ. of California, Los Angeles, Los Angeles, CA, USA
Abstract :
Power dissipation and thermal problems have become a growing issue for scaled technology. This phenomenon drives the need for advance cooling systems. It is well-known that cooling the operating temperature results in reduced electric power and/or speed gains. Since cooling cost penalizes the total power, a refrigeration system is developed and experimentally tested to demonstrate that cooling the high performance microprocessor can lead to overall system power improvement. A processor that dissipates 175.4W of maximum power with 30% electronic leakage power operating at 97°C is cooled using our refrigeration system. Measurements show that with a minimum refrigeration COP of 2.7, the processor operates with junction temperature <;40°C and offers a 25% total system power reduction over the non-refrigerated design. This experiment is the first demonstration of active cooling that lead reduced total wall power. With an improved compressor that maintains the COP across a broad range of cooling capacity, our analysis shows that at least >;13% of total power is saved across the entire range of processor utilization.
Keywords :
cooling; integrated circuit packaging; microprocessor chips; refrigeration; thermal management (packaging); advance cooling systems; compressor; electronic cooling; electronic leakage power; high performance microprocessor; power 175.4 W; power dissipation; refrigeration system; temperature 97 degC; thermal problems; total system power minimization; Cooling; Electronics cooling; Heating; Junctions; Microprocessors; Power systems; Temperature measurement;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4577-1387-3
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2011.6117155