Vacuum underfill technology for advanced packaging (IMPACT 2011)

Author

Hoshiyama, M. ; Hasegawa, M. ; Sato, T. ; Yoshii, H. ; Suzuki, O. ; Kotaka, K. ; Nagasaka, T. ; Horibe, A. ; Paquet, M.-C. ; Gaynes, M. ; Feger, C. ; Sakuma, K. ; Knickerbocker, J.U. ; Orii, Y. ; Terada, K. ; Ishikawa, K. ; Hirayama, Y.

Author_Institution

Namics Corp., Niigata, Japan

fYear

2011

fDate

19-21 Oct. 2011

Firstpage

42

Lastpage

46

Abstract

We developed vacuum underfill (VCUF) technology for large die (>;18 × 18 mm) with fine pitch area array bumps (<; 150 μm pitch) to solve a critical underfill void issue. Material development and process optimization are the keys to realize a stable process for future package. It was also confirmed that the newly developed underfill materials have good reliability on the large die package with vacuum assisted underfill process.

Keywords

electronics packaging; fine-pitch technology; integrated circuit reliability; optimisation; advanced packaging; critical underfill void; fine pitch area array bumps; large die package; process optimization; reliability; vacuum underfill technology; Delamination; Materials reliability; Three dimensional displays; Vacuum technology; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International

Conference_Location

Taipei

ISSN

2150-5934

Print_ISBN

978-1-4577-1387-3

Electronic_ISBN

2150-5934

Type

conf

DOI

10.1109/IMPACT.2011.6117165

Filename

6117165