DocumentCode :
2841429
Title :
New PC board structure for power supply technology over GHz frequency verificated with 32bit SSN driver system
Author :
Sasaoka, Norifumi ; Ochi, Takafumi ; Akiyama, Yutaka ; Kono, Kazuo ; Ueda, Chihiro ; Otsuka, Kanji
Author_Institution :
Nippon Kodoshi Corp., Kochi, Japan
fYear :
2011
fDate :
19-21 Oct. 2011
Firstpage :
55
Lastpage :
58
Abstract :
Power integrity (pi) for recent electronics circuits and systems is the most emergent technology in the GHz clock field and has been addressed in important papers through several approaches[1][2]. The latest concept of the best pi condition is recognized as maintaining lower impedance between power and ground lines or planes without any clock frequency dependency, even in the GHz region. We found this concept in a relatively old book [3] from the 1980s; thus, it is not the latest idea. However, it cannot be completely realized by the several previously proposed approaches, including many involving the use of low-inductance capacitances. We are aware that plane power and ground resonance are induced electromagnetic interference (emi) problems due to resonance caused by eddy currents or multiple reflections of voltage fluctuations. a novel technology was used in our previous study only using a conductive layer of dispersed metal particles [4]. The structure is consisted of a conventional fr-4 printed circuit board in which the copper ground plane was replaced with a metal particle conductive layer [4]. This structure improved the pi for any clock frequency especially in GHz region with an impedance of less than 1 Ω. This improvement is verified by an actual 16bit (two set) 3 Gbps/pin i/o interface board in this study. Even though the simultaneous switching of 32 drivers gave a fairly high current slew-rate of (8 mA × 32) / 60 ps = 4.27 × 109 A/s, the pi status was kept at an excellent value within 10% of the Vdd fluctuation.
Keywords :
clocks; driver circuits; eddy currents; electromagnetic interference; power supply circuits; printed circuits; PC board structure; SSN driver system; clock frequency; eddy currents; electromagnetic interference; metal particle conductive layer; power supply technology; printed circuit board; Copper; Current measurement; Fluctuations; Power supplies; Semiconductor device measurement; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4577-1387-3
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2011.6117167
Filename :
6117167
Link To Document :
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