Advanced LED wafer level packaging technologies

Currently most LED components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there is an uprising trend in the IC industry to migrate from chip-based packaging to wafer level packaging. Therefore, there is a need for LEDs to catch up. This presentation will introduce advanced LED wafer level packaging technologies. The contents will cover key enabling processes such as preparation of silicon sub-mount wafer, implementation of interconnection, deposition of phosphor, wafer level encapsulation, and their integration. The emphasis will be placed on how to achieve high throughput, low cost manufacturing through wafer level packaging.