• DocumentCode
    2841775
  • Title

    Limitations of gluing as a replacement of ultrasonic welding: Attaching Lithium battery contacts to PCBs

  • Author

    Aguilera, N. B Palacios ; Mollinger, J.R. ; Bastemeijer, J. ; Zhou, J. ; French, P.J. ; Bossche, A.

  • Author_Institution
    Electron. Instrum. Lab., Tech. Univ. Delft, Delft, Netherlands
  • fYear
    2011
  • fDate
    19-21 Oct. 2011
  • Firstpage
    230
  • Lastpage
    233
  • Abstract
    Rechargeable shapeable Lithium batteries have been in research and development by Philips in the last years resulting in an option to optimize the size of a System-in-Package. In a previous work, it was shown that gluing can replace ultrasonic welding in low power applications, nevertheless, the glued contacts require of a material to protect them from humidity in order to avoid corrosion. In this work, the reliability of the glued and welded contacts is studied, when protected by a glob top material. The contact resistance of the bonds is measured before and after a high humidity and temperature aging process. If the contacts present a change of resistance of less than 20% after the reliability test, the test is considered a pass. The welded contacts presented a change in resistance of less that 20% and the glued contacts of at least 50%. The welded contacts protected with a high purity UV curable material are the most reliable.
  • Keywords
    cells (electric); electrical contacts; printed circuit manufacture; system-in-package; PCB; glob top material; glued contacts; gluing; high purity UV curable material; lithium battery contacts; low power application; reliability test; system-in-package; temperature aging process; ultrasonic welding; welded contacts; Aluminum; Batteries; Contact resistance; Electrical resistance measurement; Materials; Nickel; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4577-1387-3
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2011.6117184
  • Filename
    6117184