Abstract :
The following topics are dealt with: advanced materials, process and assembly; modeling, simulation and design; interconnections; nanotechnology; thermal management; chipMOS; emerging systems; LED; 3D integration; and advanced packaging technologies.
Keywords :
electronics packaging; interconnections; nanotechnology; three-dimensional integrated circuits; 3D integration; LED; advanced materials; advanced packaging technologies; chipMOS; emerging systems; interconnections; modeling, simulation and design; nanotechnology; process and assembly; thermal management;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4577-1387-3
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2011.6117186
