Title :
Fully integrated AC coupled interconnect using buried bumps
Author :
Wilson, John ; Mick, Stephen ; Xu, Jian ; Luo, Lei ; Bonafede, Salvatore ; Huffman, Alan ; LaBennett, Richard ; Franzon, Paul
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
Demonstrated is the fully integrated chip and package technology proposed in ACCI. ACCI provides power and ground distribution by using a buried solder bump, and data transmission through capacitors formed between the chip and package.
Keywords :
integrated circuit interconnections; integrated circuit packaging; soldering; AC coupled interconnect; ACCI; buried solder bump; capacitors; data transmission; ground distribution; integrated chip; package technology; power distribution; Assembly; Capacitors; Copper; Coupling circuits; Data communication; Dielectric substrates; Integrated circuit interconnections; Manufacturing; Packaging; Routing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563686
