Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz

Author

Winkel, Thomas-Michael ; Deutsch, A. ; Katopis, George A. ; Kopcsay, G.V. ; Klink, E. ; Dyckman, W.D. ; Chamberlin, B.J. ; Grabinski, H. ; Surovic, C.W. ; Liu, H. ; Baks, C.

Author_Institution

IBM Entwicklungs GmbH, Boblingen, Germany

fYear

2005

fDate

24-26 Oct. 2005

Firstpage

21

Lastpage

24

Abstract

Transmission line models and material parameters are extracted from time and frequency domain measurements for product related low loss card and ceramic MCM test line structures up to 65GHz. All measured results are compared to results as obtained from field calculations showing the advantages and limitations of the different methods on product driven test vehicles.

Keywords

frequency-domain analysis; integrated circuit interconnections; multichip modules; time-domain analysis; transmission lines; MCM transmission lines; ceramic MCM test line structures; frequency domain measurement; low loss card; material parameters; multichip modules; time domain measurement; transmission line models; Ceramics; Frequency domain analysis; Frequency measurement; Loss measurement; Materials testing; Packaging; Power transmission lines; Semiconductor device measurement; Time measurement; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on

Print_ISBN

0-7803-9220-5

Type

conf

DOI

10.1109/EPEP.2005.1563690

Filename

1563690