DocumentCode :
2842438
Title :
Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications
Author :
Jinwoo Choi ; Kam, Dong Gun ; Chung, Daehyun ; Srinivasan, Krishna ; Govind, Vinu ; Kim, Joungho ; Swaminathan, Madhavan
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2005
fDate :
24-26 Oct. 2005
Firstpage :
69
Lastpage :
72
Abstract :
This paper presents near field (NF) and far field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in package and board. Three test vehicles have been designed and fabricated for near field and far field measurements. Simulation results using a full wave solver (SONNET™) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure for noise reduction in mixed-signal systems.
Keywords :
integrated circuit noise; mixed analogue-digital integrated circuits; photonic band gap; SONNET; alternating impedance electromagnetic bandgap structure; far field analysis; full wave solver; mixed-signal applications; near field analysis; noise reduction; return current radiation; Analytical models; Electromagnetic analysis; Electromagnetic measurements; Guidelines; Impedance; Noise measurement; Packaging; Periodic structures; Testing; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
Type :
conf
DOI :
10.1109/EPEP.2005.1563703
Filename :
1563703
Link To Document :
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