Title :
Characterization of microstrip interconnects over gridded ground planes
Author :
Zhu, Lin ; Melde, Kathleen L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
An equivalent circuit and modeling approach for microstrip packaging interconnects over a gridded ground plane are proposed. The equivalent characteristic impedance and propagation constant of the line are derived. The modeling approach is verified by frequency/time domain measurements.
Keywords :
equivalent circuits; frequency-domain analysis; integrated circuit interconnections; integrated circuit packaging; microstrip circuits; time-domain analysis; equivalent characteristic impedance; equivalent circuit; frequency domain measurement; gridded ground planes; microstrip packaging interconnects; propagation constant; time domain measurement; Apertures; Distributed parameter circuits; Electronics packaging; Equivalent circuits; Frequency measurement; Impedance; Integrated circuit interconnections; Microstrip; Propagation constant; Solids;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563705
