DocumentCode :
2842501
Title :
Linear circuit model combination for coupled noise simulation by using directional junction
Author :
Chen, Zhaoqing
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
fYear :
2005
fDate :
24-26 Oct. 2005
Firstpage :
83
Lastpage :
86
Abstract :
A circuit level linear model combination technique using directional junction model is proposed. The method allows direct usage of two or more existing packaging component circuit models which have some shared coverages to form a new model with a larger coverage than any individual one. The accuracy of the method is compared to the reference models. This method is useful for the applications of multiaggressor single-victim coupled noise simulation.
Keywords :
circuit simulation; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; circuit level linear model combination technique; directional junction model; linear circuit model combination; multiaggressor single-victim coupled noise simulation; packaging component circuit models; Circuit noise; Circuit simulation; Connectors; Coupling circuits; Electromagnetic modeling; Electronics packaging; Linear circuits; Noise level; Pins; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
Type :
conf
DOI :
10.1109/EPEP.2005.1563707
Filename :
1563707
Link To Document :
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