DocumentCode :
2842559
Title :
Modeling of stacked-coil inductor from silicon integrated passive device technology
Author :
Fang, Boxiang ; Tsai, Ming-Fan ; Lin, Sam ; Chuang, Min-Han ; Lee, Daniel
Author_Institution :
Siliconware Precision Ind. Co., Ltd., Taichung, Taiwan
fYear :
2011
fDate :
19-21 Oct. 2011
Firstpage :
133
Lastpage :
136
Abstract :
Stacked-coil inductor could be realized on multilevel thin-film structure with the configuration of two or more coils placed in different levels but shared the same magnetic flux. The configuration results mutual inductance to increase total inductance per unit area, it could make inductor compact to meet requirement of circuit on novel consumer electronic terminators. The metal coils of inductor on different levels are isolated by polymers which is an important component of IPD technology. Mechanical properties of polymers have strong influence on electric characteristic, which should be considered in model and will present in this paper. The scalable parameters of model are also extracted to implement process design kit (PDK) with parameterized inductors which could be used in system in package (SiP) or 3D IC interposer for RF applications.
Keywords :
coils; consumer electronics; inductors; magnetic flux; system-in-package; three-dimensional integrated circuits; 3D IC interposer; IPD technology; RF application; consumer electronic terminator; electric characteristic; inductor compact; magnetic flux; mechanical property; metal coil; multilevel thin-film structure; mutual inductance; parameterized inductor; polymer; process design kit; scalable parameter; silicon integrated passive device technology; stacked-coil inductor; system in package; Coils; Copper; Inductance; Inductors; Integrated circuit modeling; Polymers; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4577-1387-3
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2011.6117229
Filename :
6117229
Link To Document :
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