Application of transmission line models to backpanel plated through-hole via design

Author

Deng, Shaowei ; Hubing, Todd H. ; Drewniak, James L. ; Fan, Jun ; Knighten, James L. ; Smith, Norman W.

Author_Institution

Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA

fYear

2005

fDate

24-26 Oct. 2005

Firstpage

99

Lastpage

102

Abstract

This paper introduces an approach of using a plated through-hole (PTH) via transmission-line model in the design of a thick printed circuit board, such as a backpanel. Full wave FEM modeling of a section of backpanel containing a differential via pair was compared with a transmission model. Computed values of the differential transmission loss agreed within an acceptable range for engineering studies, yet the transmission line model results required less than 2% of the computation time that the full wave model required. Effects of via spacing, via diameter and trace thickness were also examined.

Keywords

circuit simulation; finite element analysis; printed circuit design; transmission lines; differential transmission loss; differential via pair; full wave FEM modeling; plated through-hole via design; printed circuit board; trace thickness; transmission line models; via diameter; via spacing; Application software; Connectors; Copper; Design engineering; Multiconductor transmission lines; Numerical models; Pins; Printed circuits; Signal design; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on

Print_ISBN

0-7803-9220-5

Type

conf

DOI

10.1109/EPEP.2005.1563711

Filename

1563711