Title :
Understanding how to model difficult features and related physical effects in electrical packages
Author_Institution :
IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
We investigate and provide solutions for a number of features that are simple and occur frequently in electrical package analysis, yet are difficult to model accurately. We also describe physical effects where the results seem unusual and suspect, but actually are physically based. We consider the current spread from vias, apparent shielding ineffectiveness of ideal conductive enclosures, negative inductance in coupled line structures, situations where adding small valued decoupling capacitors actually increases noise, and gridding and convergence issues.
Keywords :
integrated circuit modelling; integrated circuit noise; integrated circuit packaging; apparent shielding ineffectiveness; coupled line structures; decoupling capacitors; electrical package analysis; ideal conductive enclosures; negative inductance; Bars; Boundary conditions; Capacitors; Circuits; Convergence; Feeds; Inductance; Mutual coupling; Packaging;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563718