• DocumentCode
    2842675
  • Title

    Understanding how to model difficult features and related physical effects in electrical packages

  • Author

    Rubin, B.J.

  • Author_Institution
    IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2005
  • fDate
    24-26 Oct. 2005
  • Firstpage
    127
  • Lastpage
    130
  • Abstract
    We investigate and provide solutions for a number of features that are simple and occur frequently in electrical package analysis, yet are difficult to model accurately. We also describe physical effects where the results seem unusual and suspect, but actually are physically based. We consider the current spread from vias, apparent shielding ineffectiveness of ideal conductive enclosures, negative inductance in coupled line structures, situations where adding small valued decoupling capacitors actually increases noise, and gridding and convergence issues.
  • Keywords
    integrated circuit modelling; integrated circuit noise; integrated circuit packaging; apparent shielding ineffectiveness; coupled line structures; decoupling capacitors; electrical package analysis; ideal conductive enclosures; negative inductance; Bars; Boundary conditions; Capacitors; Circuits; Convergence; Feeds; Inductance; Mutual coupling; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
  • Print_ISBN
    0-7803-9220-5
  • Type

    conf

  • DOI
    10.1109/EPEP.2005.1563718
  • Filename
    1563718