DocumentCode
2842687
Title
CMOS interconnect transmission line measurements with new probe pad models
Author
Huang, Chien-Chang
Author_Institution
Dept. of Commun. Eng., Yuan Ze Univ., Chung-Li, Taiwan
fYear
2011
fDate
19-21 Oct. 2011
Firstpage
107
Lastpage
110
Abstract
In this paper, the complete models and measured results are presented for the probe pad in the CMOS on-wafer transmission line measurements using L-2L deembedding method. The transmission line parameters including characteristic impedance and propagation constant are acquired for broadband operation. The π-/T-network instead of the conventional shunt/series configuration for the probe pad are proposed with detail expressions for parameter extractions. Due to the under-determined condition for the parameter extraction, the iteration procedure is utilized. The measured results for the thin-film microstrip lines built by the 0.18 μm 1P6M process are shown from 0.2 GHz to 50 GHz.
Keywords
CMOS integrated circuits; integrated circuit interconnections; microstrip lines; semiconductor device measurement; transmission lines; CMOS interconnect transmission line measurements; characteristic impedance; deembedding method; parameter extractions; probe pad models; propagation constant; thin-film microstrip lines; Impedance; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Probes; Semiconductor device modeling; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4577-1387-3
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2011.6117236
Filename
6117236
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