• DocumentCode
    2842687
  • Title

    CMOS interconnect transmission line measurements with new probe pad models

  • Author

    Huang, Chien-Chang

  • Author_Institution
    Dept. of Commun. Eng., Yuan Ze Univ., Chung-Li, Taiwan
  • fYear
    2011
  • fDate
    19-21 Oct. 2011
  • Firstpage
    107
  • Lastpage
    110
  • Abstract
    In this paper, the complete models and measured results are presented for the probe pad in the CMOS on-wafer transmission line measurements using L-2L deembedding method. The transmission line parameters including characteristic impedance and propagation constant are acquired for broadband operation. The π-/T-network instead of the conventional shunt/series configuration for the probe pad are proposed with detail expressions for parameter extractions. Due to the under-determined condition for the parameter extraction, the iteration procedure is utilized. The measured results for the thin-film microstrip lines built by the 0.18 μm 1P6M process are shown from 0.2 GHz to 50 GHz.
  • Keywords
    CMOS integrated circuits; integrated circuit interconnections; microstrip lines; semiconductor device measurement; transmission lines; CMOS interconnect transmission line measurements; characteristic impedance; deembedding method; parameter extractions; probe pad models; propagation constant; thin-film microstrip lines; Impedance; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Probes; Semiconductor device modeling; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4577-1387-3
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2011.6117236
  • Filename
    6117236