Title :
Towards a traveling wave power distribution module using micromachined packaging techniques for millimeter and submillimeter wave applications
Author :
Dickman, E.J. ; Becker, James P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Montana State Univ., Bozeman, MT, USA
Abstract :
The design of a waveguide-based power distribution module is presented. Traveling-wave in nature and readily realizable using existing micromachining processes, the structure is a promising candidate for millimeter and submillimeter wave applications.
Keywords :
integrated circuit packaging; micromachining; millimetre wave circuits; power combiners; submillimetre wave circuits; micromachined packaging techniques; millimeter wave applications; submillimeter wave applications; traveling wave power distribution module; Application software; Frequency; Micromachining; Packaging; Planar waveguides; Power distribution; Probes; Solid state circuits; Submillimeter wave propagation; Submillimeter wave technology;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563721
