Title :
On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield Prediction
Author :
Singh, A.D. ; Krishna, C.M.
Keywords :
Hardware; Manufacturing; Production; Proposals; Semiconductor device manufacture; Semiconductor device measurement; Semiconductor device testing; Statistical analysis; Very large scale integration; Yield estimation;
Conference_Titel :
Test Conference, 1991, Proceedings., International
Print_ISBN :
0-8186-9156-5
DOI :
10.1109/TEST.1991.519514
