DocumentCode :
2842925
Title :
Analysis of system-level electromagnetic interference from electronic packages and boards
Author :
Bracken, J.E. ; Polstyanko, Sergey ; Bardi, Istvan ; Mathis, Andrew ; Cendes, Zoltan J.
Author_Institution :
Ansoft Corp., Pittsburgh, PA, USA
fYear :
2005
fDate :
24-26 Oct. 2005
Firstpage :
183
Lastpage :
186
Abstract :
We describe an approach for evaluating the system-level effects of electromagnetic interference produced by electronic packages and printed circuit boards. This problem is computationally challenging due to the high complexity of modern boards and packages and the 3D nature of the system enclosures surrounding them. We address this problem by using a decoupled approach: a specialized 2D finite element method (FEM) solver is used to compute the full-wave electrical behavior of the board and package. The radiated emissions from these planar structures are then computed in a free-space environment using the method of moments. Finally these emissions are imposed as an excitation in a 3D FEM model of the system enclosure allowing the actual system level emissions to be found. We present numerical examples that demonstrate the efficacy of the procedure.
Keywords :
electromagnetic interference; electronics packaging; finite element analysis; method of moments; printed circuits; 2D finite element method; 3D FEM model; electromagnetic interference; electronic packages; full-wave electrical behavior; method of moments; planar structures; printed circuit boards; system enclosures; system level emissions; system-level effects; Clocks; Electromagnetic analysis; Electromagnetic interference; Electronics packaging; Finite element methods; Frequency; Modems; Moment methods; Printed circuits; Signal design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
Type :
conf
DOI :
10.1109/EPEP.2005.1563732
Filename :
1563732
Link To Document :
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