Title :
A finite-volume method for on-package IR drop characterization
Author :
Wu, Xin ; Desai, Chetan
Author_Institution :
ICEPAK Electron. Div., Fluent Inc., Austin, TX, USA
Abstract :
A control-volume numerical method is developed for package IR drop analysis. By meshing conductors and solving the governing equations using a finite-volume method with multigrid linear solver, steady-state volumetric currents resulted based IR drop can be accurately and efficiently computed for power delivery analysis.
Keywords :
Laplace equations; electric potential; finite volume methods; integrated circuit packaging; linear differential equations; control-volume numerical method; finite-volume method; multigrid linear solver; on-package IR drop analysis; power delivery analysis; steady-state volumetric currents; Conductivity; Conductors; Electric potential; Finite volume methods; Laplace equations; Packaging; Power dissipation; Power systems; Steady-state; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563733
