Title :
Power supply noise-aware 3D floorplanning for system-on-package
Author :
Wong, Eric ; Minz, Jacob ; Lim, Sung Kyu
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We develop the first power supply noise-aware floorplanning for 3D system-on-package. Our 3D floorplanner aims at reducing the amount of decoupling capacitance (decap) needed to suppress the simultaneous switching noise. We perform footprint-aware decap insertion to minimize the area overhead of the 3D structure. Our effective decap distance concept allows functional blocks to access decaps in other layers.
Keywords :
integrated circuit layout; integrated circuit noise; system-in-package; 3D floorplanning; 3D structure; 3D system-on-package; decoupling capacitance; footprint-aware decap insertion; power supply noise-aware floorplanning; simultaneous switching noise; Capacitance; Circuit noise; Costs; Coupling circuits; Packaging; Power generation; Power supplies; Resonance; Temperature; White spaces;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563753
