DocumentCode
2843291
Title
Complex power distribution network investigation using SPICE based extraction from first principle formulations
Author
Selli, G. ; Drewniak, James L. ; DuBroff, R.E. ; Fan, Jintao ; Knighten, James L ; Smith, N.W. ; Archambeault, Bruce ; Grivet-Talocia, Stefano ; Canavero, Flavio
Author_Institution
EMC Lab., Missouri Univ., Rolla, MO, USA
fYear
2005
fDate
24-26 Oct. 2005
Firstpage
263
Lastpage
266
Abstract
The modeling and the analysis of the power distribution networks (PDN) within multi-layer printed circuit board is crucial for the investigation of the performance of PCB systems. Carrying out such analyses in SPICE based tools has the advantage of being faster than the corresponding full-wave modeling and it allows obtaining both frequency and time domain results.
Keywords
SPICE; frequency-domain analysis; integrated circuit interconnections; printed circuits; time-domain analysis; PCB systems; SPICE based extraction; frequency domain analysis; full-wave modeling; multilayer printed circuit board; power distribution network; time domain analysis; Analytical models; Frequency domain analysis; Geometry; Packaging; Performance analysis; Power system modeling; Power systems; Printed circuits; SPICE; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN
0-7803-9220-5
Type
conf
DOI
10.1109/EPEP.2005.1563754
Filename
1563754
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