Title :
Mid frequency decoupling using embedded decoupling capacitors
Author :
Muthana, Prathap ; Swaminathan, Madhavan ; Engin, Ege ; Raj, P. Markondeya ; Tummala, Rao
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Surface mount technology (SMT) decoupling capacitors fail to provide decoupling above 100MHz. This paper presents the use of embedded thin film capacitors to provide decoupling in the mid frequency range from 100MHz to 2GHz. On-chip capacitance provides decoupling above 2GHz. The effect of chip, package and board capacitors on the performance of digital systems is analyzed taking into account the parasitic effects of power/ground planes, vias and solder balls. A synthesis and selection methodology for embedded package capacitors is also presented.
Keywords :
UHF integrated circuits; integrated circuit packaging; thin film capacitors; 0.1 to 2 GHz; board capacitors; digital systems; embedded decoupling capacitors; embedded package capacitors; mid frequency decoupling; on-chip capacitance; power/ground planes; solder balls; surface mount technology; thin film capacitors; Capacitance; Capacitors; Electromagnetic interference; Frequency; Impedance; Inductance; Microprocessors; Packaging; Surface-mount technology; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563756
