DocumentCode :
2843533
Title :
On-chip bus interleaving revisited
Author :
Elfadel, I.M.
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2005
fDate :
24-26 Oct. 2005
Firstpage :
323
Lastpage :
326
Abstract :
Repeater interleaving is used to reduce the impact of capacitive coupling noise on the worst-case delay in local on-chip RC buses. In this paper, we revisit this interconnect design practice to evaluate it from the viewpoint of signal integrity of global on-chip interconnect used in on-chip high-speed signaling as between a cache and a CPU. Using accurate R(f)L(f)C electrical models of the global bus, we show that the peak crosstalk noise exhibits both monotonic and convex dependence on the interleaving ratio. Furthermore, we show that the worst-case switching pattern used in quantifying the common-mode noise (CMN) on the bus depends on the repeater interleaving ratio. This dependence makes the search of the optimal ratio that minimizes bus CMN quite challenging. The conclusions of this paper are valid for both unidirectional and bidirectional buses.
Keywords :
RC circuits; crosstalk; integrated circuit design; integrated circuit interconnections; integrated circuit noise; bidirectional buses; capacitive coupling noise; electrical models; global on-chip interconnect; interconnect design; local on-chip RC buses; on-chip high-speed signaling; peak crosstalk noise; repeater interleaving; signal integrity; unidirectional buses; Crosstalk; Delay estimation; Interleaved codes; Noise cancellation; Noise figure; Noise reduction; Repeaters; Signal design; Space vector pulse width modulation; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
Type :
conf
DOI :
10.1109/EPEP.2005.1563770
Filename :
1563770
Link To Document :
بازگشت