DocumentCode :
2843597
Title :
Cooling Concepts for High Power Density Magnetic Devices
Author :
Biela, J. ; Kolar, J.W.
Author_Institution :
Power Electron. Syst. Lab., Zurich
fYear :
2007
fDate :
2-5 April 2007
Firstpage :
1
Lastpage :
8
Abstract :
In the area of power electronics there is a general trend to higher power densities. In order to increase the power density the systems must be designed optimally concerning topology, semiconductor selection, etc. and the volume of the components must be decreased. The decreasing volume comes along with a reduced surface for cooling. Consequently, new cooling methods are required. In the paper an indirect air cooling system for magnetic devices which combines the transformer with a heat sink and a heat transfer component is presented. Moreover, an analytic approach for calculating the temperature distribution is derived and validated by measurements. Based on these equations a transformer with an indirect air cooling system is designed for a 10 kW telecom power supply.
Keywords :
cooling; heat sinks; magnetic devices; power electronics; power transformers; telecommunication power supplies; temperature distribution; thermal management (packaging); heat pipe; heat sink; heat transfer component; high power density magnetic devices; indirect air cooling system; power 10 kW; power electronics; telecommunication power supply; temperature distribution; thermal management; transformer; Circuit topology; Electronics cooling; Equations; Heat sinks; Heat transfer; Magnetic analysis; Magnetic devices; Power electronics; Temperature distribution; Trigeneration; Heat Pipe; Inductor; Thermal Management; Transformer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Conversion Conference - Nagoya, 2007. PCC '07
Conference_Location :
Nagoya
Print_ISBN :
1-4244-0844-X
Electronic_ISBN :
1-4244-0844-X
Type :
conf
DOI :
10.1109/PCCON.2007.372915
Filename :
4239130
Link To Document :
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