• DocumentCode
    2843598
  • Title

    Turbo-SPICE with latency insertion method (LIM)

  • Author

    Deng, Zhichao ; Schutt-Ainé, J.E.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • fYear
    2005
  • fDate
    24-26 Oct. 2005
  • Firstpage
    329
  • Lastpage
    332
  • Abstract
    In this work, the latency insertion method (LIM) for the time-domain simulation of networks is incorporated into SPICE3f5 for the faster simulation of power distribution networks. This integration is done so as to provide an accelerating option for simulation and an alternative to the resident modified nodal analysis (MNA) in SPICE. Since LIM has linear computational complexity and is substantially faster than SPICE, the new LIM-SPICE simulator allows to handle much larger networks while using the same SPICE framework. In addition, mutual inductance are handled by utilizing a K matrix formulation.
  • Keywords
    SPICE; circuit simulation; integrated circuit modelling; time-domain analysis; K matrix formulation; LIM-SPICE simulator; SPICE framework; latency insertion method; linear computational complexity; modified nodal analysis; mutual inductance; power distribution networks; time-domain simulation network; turbo-SPICE; Circuit simulation; Computational modeling; Computer simulation; Delay; Finite difference methods; Frequency; Inductors; Power systems; SPICE; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
  • Print_ISBN
    0-7803-9220-5
  • Type

    conf

  • DOI
    10.1109/EPEP.2005.1563772
  • Filename
    1563772