• DocumentCode
    2843702
  • Title

    A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire

  • Author

    Hsu, Hsiang-Chen ; Chien, Jih-Hsin ; Fu, Shen-Li

  • Author_Institution
    Dept. of Mech. & Autom. Eng., I-Shou Univ., Kaohsiung, Taiwan
  • fYear
    2011
  • fDate
    19-21 Oct. 2011
  • Firstpage
    488
  • Lastpage
    491
  • Abstract
    Electronic Submission Nano-mechanical properties of ultra-thin copper wire (ψ =0.6mil) and nano-tribology along the interfacial between free air ball (FAB) and aluminum bond pad were carefully investigated in this paper. For comparison, commercial product Pt-coated 99.99% (4N) Cu wire and pure 4N Cu wire are selected as test materials. Bonding temperature effects were taken into account for all case studies. Tensile mechanical properties were conducted through self-designed wire pull test fixture. Nono-indentation instrument was applied to obtained thin surface elastic modulus on FAB. Nanotribology and interfacial frictional behavior along smashed FAB and bond pad were measured by Atomic Force Microscopy (AFM). AFM force-displacement curve is utilized to determine the nanotribology properties. The interfacial coefficient of frictional force can be derived from a serial of calculations. A well-defined contact area is measured to study the frictional force and friction stress. The roughness of contact surface influences the contact between friction and surface forces. The study of roughness parameters corresponds to evaluate the friction and the interfacial strengths. Local variation in micro/nano tribology is also measured.
  • Keywords
    copper; electronics packaging; lead bonding; micromechanics; nanoindentation; nanomechanics; platinum; tribology; AFM; Atomic Force Microscopy; FAB; Pt-Cu; Tensile mechanical properties; aluminum bond pad; contact area; electronic submission nanomechanical properties; force-displacement curve; free air ball; friction stress; frictional force; microtribology; nanoindentation instrument; nanotribology; ultrathin 4N copper wire; ultrathin copper wire; wire pull test fixture; Coatings; Copper; Finite element methods; Force; Force measurement; Probes; Wires; Nano-mechanical; Pt-coated Cu wire; nano-tribology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4577-1387-3
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2011.6117291
  • Filename
    6117291