Title :
Low-cost 10 Gb/s chip-to-chip optical interconnect
Author :
Hashim, Aeffendi ; Bamiedakis, Nikos ; Penty, Richard V. ; White, Ian H.
Author_Institution :
Dept. of Eng., Univ. of Cambridge, Cambridge, UK
Abstract :
A fully-integrated chip-to-chip optical interconnect fabricated on a low-cost single-layered FR4 substrate primarily using conventional electronic manufacturing practices is demonstrated. The interconnect achieves error-free 10 Gb/s data transmission and a better than ±13 μm tolerance to component misalignments.
Keywords :
optical interconnections; chip-to-chip optical interconnect; component misalignment; conventional electronic manufacturing practice; data transmission; Connectors; Optical device fabrication; Optical interconnections; Optical receivers; Optical transmitters; Optical waveguides; Vertical cavity surface emitting lasers;
Conference_Titel :
Optical Communication (ECOC), 2010 36th European Conference and Exhibition on
Conference_Location :
Torino
Print_ISBN :
978-1-4244-8536-9
Electronic_ISBN :
978-1-4244-8534-5
DOI :
10.1109/ECOC.2010.5621276
