DocumentCode
2846072
Title
An overview of reliability testing challenges in integrated power amplifier modules for wireless applications
Author
Qu, Y. ; Scott, P. ; Marchut, L. ; Ferrara, M.
fYear
2005
fDate
Oct. 30, 2005
Firstpage
95
Lastpage
108
Keywords
Assembly; Gallium arsenide; MMICs; Manufacturing industries; Power amplifiers; Qualifications; Radio frequency; Radiofrequency amplifiers; Semiconductor device packaging; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
ROCS Workshop, 2005. [Reliability of Compound Semiconductors]
Print_ISBN
0-7908-0106-X
Type
conf
DOI
10.1109/ROCS.2005.201556
Filename
1563940
Link To Document