DocumentCode :
2846174
Title :
An approximate analysis of microstrip lines with finite metallization thickness and conductivity by method of lines
Author :
Feng, N.-N. ; Fang, D.G. ; Huang, W.-P.
Author_Institution :
Dept. of Electron. Eng., Nanjing Univ. of Sci. & Technol., China
fYear :
1998
fDate :
1998
Firstpage :
1053
Lastpage :
1056
Abstract :
Using the approximate spectral domain Green´s function, which is based on the current and charge distribution at the top and bottom surfaces of the microstrip, an approximate analysis of microstrip lines with finite metallization thickness and conductivity by method of lines (MOL) combined with the synthetic asymptote method is presented. Also the loss of dielectric and ground plane have been taken into account in the analysis. Numerical results show the validity of this method
Keywords :
Green´s function methods; current distribution; metallisation; method of lines; microstrip lines; approximate analysis; charge distribution; current distribution; dielectric plane loss; finite conductivity; finite metallization thickness; ground plane loss; method of lines; microstrip lines; spectral domain Green function; synthetic asymptote method; Attenuation; Conductivity; Conductors; Dielectric constant; Dielectric losses; MMICs; Metallization; Microstrip; Skin; Surface impedance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave and Millimeter Wave Technology Proceedings, 1998. ICMMT '98. 1998 International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4308-5
Type :
conf
DOI :
10.1109/ICMMT.1998.768471
Filename :
768471
Link To Document :
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