Title :
LSI subsystems assembled by the silicon water-chip technique
Author_Institution :
Philco-Ford Corp., Blue Bell, PA
Keywords :
Assembly; Circuits; Cost function; Large scale integration; Logic arrays; Logic design; Packaging; Shift registers; Silicon; Wafer bonding;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1968 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1968.1154627
