DocumentCode

2846439

Title

LSI subsystems assembled by the silicon water-chip technique

Author

Thornton, C.

Author_Institution

Philco-Ford Corp., Blue Bell, PA

Volume

XI

fYear

1968

fDate

14-16 Feb. 1968

Firstpage

42

Lastpage

43

Keywords

Assembly; Circuits; Cost function; Large scale integration; Logic arrays; Logic design; Packaging; Shift registers; Silicon; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference. Digest of Technical Papers. 1968 IEEE International

Conference_Location

Philadelphia, PA, USA

Type

conf

DOI

10.1109/ISSCC.1968.1154627

Filename

1154627