Title :
An alternative method for electro-thermal circuit simulation
Author :
Rencz, M. ; Székely, V. ; Páhi, A. ; Poppe, A.
Author_Institution :
Dept. of Electron Devices, Tech. Univ. Budapest, Hungary
Abstract :
In recent years great attention has been paid to the thermal issues in electronics design on system, board, package and chip level, including thermal and electro-thermal simulation of integrated circuits and MCM-s, or even integrated microsystems. In this paper we address some algorithmic issues regarding the method of simultaneous iteration. With the node reduction algorithm outlined here, electro-thermal simulation of large problems becomes feasible. Besides this algorithmic innovation, we provide a specification for a modular, platform independent electro-thermal simulator
Keywords :
circuit simulation; thermal analysis; algorithmic issues; electro-thermal circuit simulation; large problems; modular simulator; node reduction algorithm; platform independent simulator; simulator specification; simultaneous iteration; Circuit simulation; Electron devices; Electronic packaging thermal management; Integrated circuit modeling; Integrated circuit packaging; Relaxation methods; Software packages; Technological innovation; Temperature; Very large scale integration;
Conference_Titel :
Mixed-Signal Design, 1999. SSMSD '99. 1999 Southwest Symposium on
Conference_Location :
Tucson, AZ
Print_ISBN :
0-7803-5510-5
DOI :
10.1109/SSMSD.1999.768603
