DocumentCode
2846868
Title
Simulation, testing and modeling of the thermal behavior and electro-thermal interactions in ICs, MCMs and PWBs
Author
Székely, V. ; Renez, M. ; Courtois, B.
Author_Institution
Tech. Univ. Budapest, Hungary
fYear
1999
fDate
1999
Firstpage
168
Lastpage
173
Abstract
The paper presents tools and methods for the simulation, testing and modeling of the thermal behavior and electro-thermal interactions in ICs, MCMs and PWBs. Examples demonstrate the usability of the methods
Keywords
circuit simulation; digital simulation; integrated circuit modelling; multichip modules; printed circuits; temperature distribution; thermal analysis; ICs; MCM; PCB; PWB; SUNRED program; THERMAN tool; THERMODEL; dynamic simulation; electro-thermal interactions; modeling; testing; thermal behavior; thermal simulation; Boundary conditions; Circuit simulation; Circuit testing; Circuits and systems; Frequency domain analysis; Heat transfer; Power system modeling; System testing; Temperature; Usability;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed-Signal Design, 1999. SSMSD '99. 1999 Southwest Symposium on
Conference_Location
Tucson, AZ
Print_ISBN
0-7803-5510-5
Type
conf
DOI
10.1109/SSMSD.1999.768612
Filename
768612
Link To Document