Title :
UHF integrated power amplifiers
Author_Institution :
RCA Electronic Components, Somerville, N.J., USA
Abstract :
Integrated UHF power amplifiers using thin-film lumped-elements affording powers as high as 20 W and bandwidths as much as 40% in the 225-400 MHz band will be described.
Keywords :
Bandwidth; Broadband amplifiers; Capacitors; Chebyshev approximation; Impedance matching; Inductors; Power amplifiers; Thin film circuits; Thin film transistors; UHF circuits;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1969 IEEE Internationa
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1969.1154717