DocumentCode
2848272
Title
A probe routing algorithm for MCM substrate test
Author
Yan, Rongchang ; Kim, Bruce C.
Author_Institution
Dept. of Electr. Eng., Tufts Univ., Medford, MA, USA
fYear
1998
fDate
15-17 Apr 1998
Firstpage
87
Lastpage
91
Abstract
In this paper, we describe a novel heuristic algorithm based on the single-ended probe which is used to reduce the single-ended probe travel time in MCM substrate testing. Our algorithm has been successfully implemented and compared with previous results. The results show that significant improvements are achieved using the new heuristic algorithm
Keywords
automatic testing; circuit reliability; integrated circuit interconnections; integrated circuit packaging; multichip modules; printed circuit testing; MCM substrate test; MCM substrate testing; heuristic algorithm; probe routing algorithm; single-ended probe; single-ended probe travel time; Capacitance; Costs; Heuristic algorithms; Optical films; Optical interconnections; Packaging; Probes; Routing; Substrates; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location
Denver, CO
Print_ISBN
0-7803-4850-8
Type
conf
DOI
10.1109/ICMCM.1998.670760
Filename
670760
Link To Document