Title :
CVD diamond film sink for high power MCMs
Author :
Xie, Kuojun ; Jiang, Changshun ; Xu, Haifeng ; Zhu, Lin
Author_Institution :
Sch. of Phys. Electron., China Univ. of Electron. Sci. & Technol., Chengdu, China
fDate :
30 Aug.-2 Sept. 2005
Abstract :
As electronic packages become more compact, run at faster speeds and dissipate more heat, package designers need more effective thermal management materials. CVD Diamond, because of its high thermal conductivity, low dielectric loss and its great mechanical strength, is an excellent material for three dimensional (3-D) multichip modules (MCMs) in the next generation compact, high speed computers and high power microwave components. In this paper, we have synthesized a large area free-standing diamond films and substrates, and polished diamond substrates, which make MCMs diamond film sink becomes a reality.
Keywords :
chemical vapour deposition; diamond; heat sinks; multichip modules; substrates; thin films; 3D multichip modules; CVD; diamond film sink; diamond substrates; electronic packages; free-standing diamond films; high power MCM; high power microwave components; high speed computers; low dielectric loss; mechanical strength; thermal conductivity; thermal management materials; Conducting materials; Dielectric losses; Dielectric materials; Dielectric substrates; Electromagnetic heating; Electronic packaging thermal management; Multichip modules; Thermal conductivity; Thermal management; Thermal management of electronics;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564611
