• DocumentCode
    2848581
  • Title

    Parametric cost estimating: a practical independent method of estimating the manufacturing cost of chips to modules in the Peoples Republic of China

  • Author

    Farrington, Ralph W.

  • Author_Institution
    RWF Consulting LLC, Newport Beach, CA, USA
  • fYear
    2005
  • fDate
    30 Aug.-2 Sept. 2005
  • Firstpage
    336
  • Lastpage
    337
  • Abstract
    The cost estimating discipline is making rapid progress in the Peoples Republic of China. Parametric cost estimating tools, including a microcircuit parametric estimating model, have been introduced to the major large system developers in China. The parametric cost estimating process not only estimates product cost but also provides an effective program cost management tool used for design to cost trade studies. This paper introduces the parametric cost estimating method and explores the parametric process when applied to an advanced microcircuit packaging (LTCC) in a high volume, relatively low cost application used in a rugged environment. The PRICE Systems Microcircuit (PRICE M) parametric cost estimating model is presented along with its fundamental cost drivers and factors. An independent parametric estimate for a low temperature cofired ceramic (LTCC) microcircuit module is presented. The required estimating parameters and the resulting estimate is described along with a technical walk-thru using the independent parametric estimate of the 24 GHz short range radar sensor for automotive applications. The independent cost analysis estimate is based upon a microcircuit developed in a joint project of IMST GmbH (Germany) with DuPont Microcircuit Materials (a detailed presentation of the microcircuit project is described in the IMAPS Advancing Microelectronics March/April 2005 publication). The packaged chips and all components along with the LTCC substrate cost and assembly and test costs of the assembled module is estimated and presented. The entire estimate uses P.R. China financial factors.
  • Keywords
    automotive electronics; costing; integrated circuit manufacture; integrated circuit packaging; sensors; 24 GHz; LTCC substrate cost; PRICE Systems Microcircuit; advanced microcircuit packaging; assembly cost; automotive applications; cost analysis; cost management tool; design to cost trade; financial factor; low temperature cofired ceramic; manufacturing cost estimation; microcircuit parametric estimating model; parametric cost estimation; product cost; radar sensor; test costs; Assembly; Automotive applications; Ceramics; Costs; Manufacturing; Packaging; Parameter estimation; Radar applications; Sensor phenomena and characterization; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2005 6th International Conference on
  • Print_ISBN
    0-7803-9449-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2005.1564614
  • Filename
    1564614