Title : 
Tensile properties of polysilicon in surface micromachining
         
        
            Author : 
Lu, Xiaoqing ; Ye, Xiongying ; Zhou, Zhaoying ; Li, Chen ; Yang, Yihua
         
        
            Author_Institution : 
Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
         
        
        
        
        
        
            Abstract : 
Polysilicon is widely used in surface micromachining and often acts as the essential structural material. So mechanical properties of polysilicon are very important for microstructure design. In this paper we propose a simple method using spinner to measure the tensile property of a polysilicon microbeam fabricated by a routine surface process. The specimen is a cantilever with a paddle on which nickel is electroplated to form a seismic mass. When the specimen is placed along the radial vector, the centrifugal force caused by the seismic mass will pull the cantilever to fracture. This method enables a simple specimen preparation and measurement process
         
        
            Keywords : 
elemental semiconductors; fracture toughness; fracture toughness testing; micromachining; silicon; specimen preparation; tensile strength; tensile testing; Si; cantilever with paddle; centrifugal force; electroplated nickel; fracture; mechanical properties; microbeam; microcracks; microstructure design; polysilicon; radial vector; seismic mass; simple specimen preparation; surface micromachining; tensile properties; tensile strength; tensile testing; Crystalline materials; Fatigue; Mechanical factors; Mechanical variables measurement; Micromachining; Micromechanical devices; Nickel; Seismic measurements; Silicon; Testing;
         
        
        
        
            Conference_Titel : 
Micromechatronics and Human Science, 1997. Proceedings of the 1997 International Symposium on
         
        
            Conference_Location : 
Nagoya
         
        
            Print_ISBN : 
0-7803-4171-6
         
        
        
            DOI : 
10.1109/MHS.1997.768886