Abstract :
Many different inspection systems are available to manufacturers of electronic components. But new inspection challenges are pushing - and in many cases exceeding - the limits of conventional inspection tools, such as wafer probes and automated optical inspection systems. A more capable alternative is X-ray technology, which can penetrate substrate materials to expose hidden features in electronic assemblies. Equipped with this cutting-edge tool for detecting material flaws and component defects, manufacturers can improve product quality and increase customer satisfaction, while also reducing costs and increasing manufacturing efficiency. This paper discusses X-ray inspection systems and their importance in failure analysis and process control of electronic components. Besides describing basic X-ray technology, the paper looks at a number of recent developments in X-ray systems and shows how these developments improve the inspection of TCs, PCBs, packages, and wafer bumps
Keywords :
X-ray imaging; automatic optical inspection; electron device manufacture; failure analysis; process control; X-ray inspection; automated optical inspection systems; component defects; electronic component manufacturing; failure analysis; material flaws; process control; product quality improvement; wafer bump voids; Assembly; Automatic optical inspection; Costs; Customer satisfaction; Electronic components; Manufacturing; Optical materials; Probes; X-ray detection; X-ray detectors;
