Title :
Effect of Die Bonding on MEMS Characteristics: Cell Library Study
Author :
Song, Jing ; Tang, Jie-ying ; Huang, Qing-An
Author_Institution :
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing
Abstract :
Thermal mismatch induced by the die bonding structure will have a great effect on the reliability and performance of MEMS devices. A cell library method is introduced here as an alternative against conventional FEM simulation to simplify the package-device co-design and the parametric study of MEMS components. Cells of package substrate, anchor and micro-beam are first modeled individually and then integrated together on their boundary conditions to study the concerned response. Effects of die bonding on the pull-in voltage of a doubly supported micro-beam are predicted using this method and the results are in good agreement with FEM calculations. This study indicates the importance of package-device co-design and the need for the development of MEMS own standard package solutions aiming at stress miniaturization and modeling simplification
Keywords :
microassembling; micromechanical devices; packaging; reliability; MEMS characteristics; cell library; die bonding; doubly supported micro-beam; package substrate cell; package-device co-design; pull-in voltage; stress miniaturization; thermal mismatch; Boundary conditions; Libraries; Microassembly; Microelectromechanical devices; Micromechanical devices; Packaging; Parametric study; Standards development; Stress; Voltage;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564627
