DocumentCode
2849004
Title
The Development of Semiconductor Packaging Industry in China
Author
Bi, Keyun
Author_Institution
The vice board chairperson of China Semiconductor Industry Association The board chairperson of China Semiconductor Industry Association Packaging Branch The board chairperson of study of production technology branch of Chinese Institute of Electronics (T
fYear
2005
fDate
30 Aug.-2 Sept. 2005
Firstpage
1
Lastpage
2
Keywords
Chip scale packaging; Consumer electronics; Electronic equipment testing; Electronics industry; Electronics packaging; Industrial electronics; Integrated circuit packaging; Marketing and sales; Semiconductor device packaging; Semiconductor device testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN
0-7803-9449-6
Type
conf
DOI
10.1109/ICEPT.2005.1564642
Filename
1564642
Link To Document