Title :
The Development of Semiconductor Packaging Industry in China
Author_Institution :
The vice board chairperson of China Semiconductor Industry Association The board chairperson of China Semiconductor Industry Association Packaging Branch The board chairperson of study of production technology branch of Chinese Institute of Electronics (T
fDate :
30 Aug.-2 Sept. 2005
Keywords :
Chip scale packaging; Consumer electronics; Electronic equipment testing; Electronics industry; Electronics packaging; Industrial electronics; Integrated circuit packaging; Marketing and sales; Semiconductor device packaging; Semiconductor device testing;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564642
