• DocumentCode
    2849061
  • Title

    The paradigm of "more than Moore"

  • Author

    Zhang, G.Q. ; van Roosmalen, F. ; Graef, M.

  • Author_Institution
    Strategy & Bus. Dev., Philips Semicond., Eindhoven, Netherlands
  • fYear
    2005
  • fDate
    30 Aug.-2 Sept. 2005
  • Firstpage
    17
  • Lastpage
    24
  • Abstract
    Microelectronics has pervaded our lives for the past fifty years, with massive penetration into health, mobility, security, communications, education, entertainment, and virtually every aspect of human lives. In the past decades, as the main stream, these progresses are powered by Moore\´s law, with two focused development arenas, namely, IC miniaturization down to nano dimension, and SoC based system integration. While microelectronics community continues to invent new solutions around the world to keep Moore\´s law alive, there are ever-increasing awareness, R&D effort and business drivers to push the development and application of "more than Moore" (MtM) that are based upon or derived from silicon technologies but do not scale with Moore\´s law (with typical examples as RF, power, sensor and actuator, SiP, heterogeneous integration, etc.). This emerging trend is partially trigged by the increasing social needs for high level system integration including non-digital functionalities, the necessity to broaden the product portfolio of existing wafer fabs, and the limiting economic and time factors of advanced SoC development. Starting from the rationale of MtM, this paper will highlight some strategic research subjects for the major "MtM" related technology building blocks. Some issues related to the paradigm of MtM, covering industrial vision, strategy and business models, will also be discussed.
  • Keywords
    integrated circuits; nanotechnology; research and development; silicon; system-on-chip; IC miniaturization; Moore law; SoC; business models; high level system integration; industrial vision; microelectronics; product portfolio; research and development; silicon technologies; wafer fabs; Actuators; Communication system security; Humans; Microelectronics; Moore´s Law; Portfolios; Power system security; Radio frequency; Research and development; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2005 6th International Conference on
  • Print_ISBN
    0-7803-9449-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2005.1564646
  • Filename
    1564646