DocumentCode
2849102
Title
Prediction of Solder Joint geometry for Optical Fiber attachment Assembly in Direct-Coupling Applications
Author
Wei, Zhang ; Chunqing, Wang ; Yanhong, Tian
Author_Institution
Sch. of Material Sci. & Eng., Harbin Inst. of Technol.
fYear
2005
fDate
2-2 Sept. 2005
Firstpage
1
Lastpage
3
Abstract
Fiber attachment soldering is low cost and high-precision technology in direct-coupling optoelectronic packaging. The three-dimensional shape of solder joint in fiber attachment soldering was predicted by using the public domain software called Surface Evolver. The influences of material and manufacturing parameters on solder joint geometry and the stand-off height were investigated. The results can be used to control the solder joint geometry and to improve the alignment of optical fiber
Keywords
electronics packaging; integrated optoelectronics; optical fibre couplers; optical interconnections; soldering; 3D shape; Surface Evolver; direct-coupling application; fiber attachment soldering; optical fiber attachment assembly; optoelectronic packaging; public domain software; solder joint geometry prediction; Application software; Assembly; Costs; Geometrical optics; Joining materials; Optical fibers; Optical materials; Packaging; Shape; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2005 6th International Conference on
Conference_Location
Shenzhen
Print_ISBN
0-7803-9449-6
Type
conf
DOI
10.1109/ICEPT.2005.1564649
Filename
1564649
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