DocumentCode
2849158
Title
3D System Integration
Author
Klumpp, Armin ; Merkel, Reinhard ; Ramm, Peter ; Wieland, Robert
Author_Institution
Fraunhofer Inst. for Reliability & Microintegration, Munich
fYear
2007
fDate
23-25 April 2007
Firstpage
1
Lastpage
2
Abstract
3D-integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental concepts will be described, as well as appropriate handling concepts.
Keywords
chip scale packaging; integrated circuit interconnections; low-power electronics; multichip modules; system-in-package; 3D system integration; interconnect densities; low power consumption; multiple chip stacks; ultra thin silicon technologies; Appropriate technology; Copper; Electric resistance; Energy consumption; Power system interconnection; Power system reliability; Silicon; Solids; Through-silicon vias; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems and Applications, 2007. VLSI-TSA 2007. International Symposium on
Conference_Location
Hsinchu
ISSN
1524-766X
Print_ISBN
1-4244-0584-X
Electronic_ISBN
1524-766X
Type
conf
DOI
10.1109/VTSA.2007.378924
Filename
4239492
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