Title :
90nm Phase Change Technology with μTrench and Lance Cell Elements
Author :
Atwood, G. ; Bez, R.
Author_Institution :
Intel Corp., Santa Clara
Abstract :
Phase change memory is rapidly emerging as a promising next generation non volatile memory, offering unique capabilities for performance and functionality. Integration of the chalcogenide phase change material into a memory cell structure and memory array offers many challenges and opportunities. In this paper, the electrical properties of two possible cell structures, μTrench and Lance, will be compared using multi-megabit arrays at 90 nm. Results of the integration of PCM at 90 nm using a bipolar selector and with a cell area of 12 F2 will be described, demonstrating the suitability of PCM for high density memory applications.
Keywords :
isolation technology; nanoelectronics; phase change materials; random-access storage; semiconductor storage; μTrench elements; Lance cell elements; bipolar selector; chalcogenide material; high-density memory; memory array; memory cell structure; nonvolatile memory; phase change memory technology; size 90 nm; Costs; Educational institutions; Flash memory; History; Nonvolatile memory; Phase change materials; Phase change memory; Phased arrays; Scalability; Voltage;
Conference_Titel :
VLSI Technology, Systems and Applications, 2007. VLSI-TSA 2007. International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
1-4244-0584-X
Electronic_ISBN :
1524-766X
DOI :
10.1109/VTSA.2007.378938